| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a higher productivity wafer joining method that can join wafers while preventing foreign materials from coming between the wafers. <P>SOLUTION: The wafer joining method is for joining wafers with both circular primary planes having two side planes to be orientation flats. While the wafers are mounted on a joining jig comprising a first wall and a flat plate with a second wall through-hole so that the side planes to be orientation flats can contact the second wall, the wafers are irradiated with light emitted from an excimer irradiation lamp. While the wafers are aspirated through the through hole of the flat plate and held at the joining jig, the side plane of the flat plate and the side plane of the first wall are adjacently arranged so that the wafers are contacted and joined. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
