| 摘要 |
An embodiment of the present invention provides a semiconductor apparatus capable of determining that a metal layer and a bump are properly stacked by electrically separating the bump from the metal layer connected to the bump. The semiconductor apparatus comprises a semiconductor chip which includes a first pad, a second pad, and a bump. The first pad may receive a signal from an external apparatus. The second pad has first and second metal layers which are electrically separated. The bump is stacked on the second pad and may receive a signal transmitted from the control chip. |
