发明名称 Sputtering device
摘要 <p>The present invention provides a high efficiency magnetron sputtering device in which an earth shield obtained from a magnetic body is disposed on the periphery of the target, wherein unintended discharge between the cathode and the earth shield can be reduced. The sputtering device of an embodiment of the present invention is provided with: a backing plate (7), which is connected to a power source and has a target-mounting surface; a magnet (8) disposed on the back surface of the backing plate; a grounded shield (14) surrounding the perimeter of the target-mounting surface and comprising a magnetic material; and fixing sections (13), which are magnetic members located between the backing plate and the shield on the periphery of the target-mounting surface. Lines of magnetic force that pass through the spaces between the shield and the fixing sections are thereby reduced.</p>
申请公布号 GB2522600(A) 申请公布日期 2015.07.29
申请号 GB20150010085 申请日期 2013.11.19
申请人 CANON ANELVA CORPORATION 发明人 MASATO SHINADA;KEISUKE UEDA
分类号 C23C14/35;H01J37/32;H01J37/34 主分类号 C23C14/35
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