Member for solid-state image pickup device and method for manufacturing solid-state image pickup device having first and second wiring structures with a concave portion between first and second substrates

摘要

A member for a solid-state image pickup device having a bonding plane with no gaps and a method for manufacturing the same are provided. The manufacturing method includes the steps of providing a first substrate provided with a photoelectric converter on its primary face and a first wiring structure, providing a second substrate provided with a part of a peripheral circuit on its primary face and a second wiring structure, and performing bonding so that the first substrate, the first wiring structure, the second wiring structure, and the second substrate are disposed in this order. In addition, at least one of an upper face of the first wiring structure and an upper face of the second wiring structure has a concave portion, and a conductive material forms a bottom face of the concave portion.

主权项

1. A method for manufacturing a solid state image pickup device, comprising the steps of:
providing a first member including a first substrate and a first wiring structure disposed on the first substrate, the first substrate being provided with at least one of a transistor and a photoelectric converter; providing a second member including a second substrate and a second wiring structure disposed on the second substrate, the second substrate being provided with a transistor; and bonding the first member and the second member so that the first wiring structure and the second wiring structure are disposed between the first substrate and the second substrate, wherein before the step of bonding, at least one of a face of the first member which is to face the second member and a face of the second member which is to face the first member has a concave portion, and at least a part of the concave portion is formed by a conductive material.