Communication system die stack

摘要

A high density, low power, high performance information system, method and apparatus are described in which perpendicularly oriented processor and memory die stacks (130, 140, 150, 160, 170) include integrated deflectable MEMS optical beam waveguides (e.g., 190) at each die edge to provide optical communications (182-185) in and between die stacks by supplying deflection voltages to a plurality of deflection electrodes (195-197) positioned on and around each MEMS optical beam waveguide (193-194) to provide two-dimensional alignment and controlled feedback to adjust beam alignment and establish optical communication links between die stacks.

主权项

1. A die stack system comprising:
a system board; a first die stack module affixed to the system board, the first die stack module comprising a first plurality of stacked die, each comprising a first deflectable optical beam waveguide at a die edge and a first plurality of deflection electrodes positioned to align the first deflectable optical beam waveguide to provide a direct optical link to another die; and a second die stack module affixed to the system board to be adjacent to the first die stack module, the second die stack module comprising a second plurality of stacked die, each comprising a second deflectable optical beam waveguide at a die edge and a second plurality of deflection electrodes positioned to align the second deflectable optical beam waveguide to provide an optical link to a die of another die stack module.