Semiconductor device and method for manufacturing semiconductor device

摘要

A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.

主权项

1. A semiconductor device comprising:
a plurality of die pads each having a bottom surface; a plurality of semiconductor chips each of which is disposed on a respective one of the die pads; a sealing resin covering top surfaces of the plurality of die pads and the semiconductor chips, the sealing resin extending about the sides of and extending below the bottom surfaces of the plurality of die pads to form a recess comprised of the extended portion of the sealing resin as a recess side surface, the recess exposing the bottom surfaces of the plurality of die pads within the recess; a heat dissipation plate configured for insertion into and disposed in the recess; and an intermediate layer including a plurality of first portions; wherein each of the first portions bonds a respective one of the plurality of die pads to the heat dissipation plate and is disposed between the respective one of the die pads and the heat dissipation plate, and wherein the recess includes a recess side surface and a recess bottom surface spaced apart from the heat dissipation plate.