Composites comprised of aligned carbon fibers in chain-aligned polymer binder

摘要

A method for enhancing internal layer-layer thermal interface performance and a chip stack of semiconductor chips using the method. The method includes adding a thermosetting polymer to the thermal interface material, dispersing a plurality of nanofibers into the thermal interface material, and un-crosslinking the thermosetting polymer in the thermal interface material. The method further includes extruding the thermal interface material through a die to orient the conductive axis of the nanofibers and polymer chains in the desired direction, and re-crosslinking the thermosetting polymer in the thermal interface material. The chip stack includes a first chip with circuitry on a first side, a second chip coupled to the first chip by a grid of connectors, and a thermal interface material pad between the chips. The thermal interface includes nanofibers and a polymer that allows for optimal alignment of the nanofibers and polymer chains.

主权项

1. A method for aligning a plurality of nanofibers in a thermal interface material to enhance performance of the thermal interface material, comprising:
adding at least one thermosetting polymer to the thermal interface material, wherein at least one of the at least one thermosetting polymer has a polymer chain; dispersing the plurality of nanofibers into the thermal interface material; un-crosslinking the at least one thermosetting polymer in the thermal interface material; and extruding the thermal interface material through a die to orient the conductive axis of the nanofibers and the polymer chains in the desired direction; and re-crosslinking the at least one thermosetting polymer in the thermal interface material.