APPARATUS AND METHOD FOR MEASURING COUPLING DELAY OF THROUGH SUBSTRATE VIA

摘要

The present invention relates to an apparatus and a method for measuring interference delay of a through an electrode. According to the present invention, the apparatus thereof is capable of measuring interference delay of through electrodes for transmitting a signal between stacked dies of a three dimensional semiconductor. Provided is the apparatus for measuring interference delay of a through electrode comprising: a chain generation part to divide through electrodes into a plurality of groups based on a first through electrode determined among the through electrodes, and to connect the through electrodes in each of a plurality of groups by a chain structure; and an interference delay measurement part to measure the sub-interference delay time between the through electrodes connected by the chain structure by each of a plurality of groups, and to measure the interference delay time of the through electrodes by using the sub-interference delay time measured by each of a plurality of groups.