Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules

摘要

Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.

主权项

1. A method of fabricating optoelectronic modules each of which includes at least one optoelectronic device and at least one an optical element, the method comprising:
providing a transparent wafer having first and second surfaces on opposite sides of the transparent wafer, wherein there are a plurality of non-transparent spacer elements on one of the surfaces of the transparent wafer; forming openings in the transparent wafer, each opening disposed over a respective one of the spacer elements and extending through the transparent wafer; and substantially filling the openings in the transparent wafer with a material that is non-transparent to light emitted by or detectable by the optoelectronic device.