| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for suppressing mounting deviation or mounting failure of an electronic component, while allowing electronic components of different size to be mounted at the same position on the plane of a printed wiring board.SOLUTION: In printed wiring board having lands for surface mounting an electronic component, the land has a pair of land pieces arranged oppositely. Each land piece includes a plurality of lands having widths different from each other, and a coupling part for coupling the boundaries of a pair of adjacent lands partially. |
