摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can achieve down sizing while minimizing an influence of current unbalance between semiconductor elements.SOLUTION: An inverter device 1 includes: a lower substrate 11; and a switching element group composed of a plurality of switching elements 15 which are connected in parallel with each other and mounted on the lower substrate 11 so as to be arranged in a longer direction. The switching elements 15 are arranged in a direction orthogonal to the longer direction of the lower substrate 11. The switching element group 16 is mounted on the lower substrate 11 in a state where the plurality of switching elements 15 are divided into two element groups 16A. The inverter device 1 further includes a plurality of rectangular input electrode patterns 17 and a plurality of circular output electrode patterns 18 which are formed and alternately arranged in a region of the lower substrate 11 between the element groups 16A. The input electrode patterns are electrically connected with input terminals via rectangular relay electrodes, respectively. |