| 主权项 |
1. A method of manufacturing a plurality of part-mounting packages by a multi-cavity technique, wherein each of the plurality of part-mounting packages includes a substrate base shaped as a plate having a multilayered structure in which a plurality of insulating layers and a plurality of conductor layers are laminated, the substrate base including a substrate front surface, a substrate rear surface, and substrate side surfaces, at least one of the substrate side surfaces defining a side surface recess including a first recessed region, a second recessed region adjacent to the first recessed region in a thickness direction of the substrate base, and a step formed at a boundary between the first recessed region and the second recessed region, each of the plurality of part-mounting packages further including a part connection terminal on the substrate front surface to which an electronic part can be connected, an external connection terminal on the substrate rear surface, and an end face through-hole conductor covering the second recessed region and avoiding the first recessed region,
the method comprising: a sheet preparation process of preparing a plurality of multi-cavity insulating sheets, including a first insulating sheet and a second insulating sheet, of an insulating material; a through-hole forming process of forming a first through-hole in the first insulating sheet and forming a second through-hole whose opening area is larger than the first through-hole in the second insulating sheet; a conductor forming process of forming a penetration conductor covering an inner surface of the second through-hole and forming a first conductor layer on a surface of the second insulating sheet; a sheet lamination process of laminating the first insulating sheet on the second insulating sheet such that a center of the first through-hole is in alignment with a center of the second through-hole to form a sheet laminated body; a division groove forming process of laser machining the sheet laminated body to form linear laser division grooves that pass through the center of the first through-hole and the center of the second through-hole; and a dividing process of dividing the sheet laminated body along the laser division grooves for separating the sheet laminated body into the plurality of part-mounting packages and exposing a separation surface of each of the plurality of part-mounting packages; wherein the separation surface exposed by the dividing process is the at least one substrate side surface defining the side surface recess, and a portion of the penetration conductor exposed by the dividing process is the end face through-hole conductor of each of the plurality of part-mounting packages. |
