TOROID INDUCTOR IN REDISTRIBUTION LAYERS (RDL) OF AN INTEGRATED DEVICE

摘要

Some features pertain to an integrated device that includes a substrate, several metal layers coupled to the substrate, several dielectric layers coupled to the substrate, a first metal redistribution layer coupled to one of the metal layers, and a second metal redistribution layer coupled to the first metal redistribution layer. The first and second metal redistribution layers are configured to operate as a toroid inductor in the integrated device. In some implementations, the integrated device also includes a third metal redistribution layer. The third metal redistribution layer is coupled to the first and second metal redistribution layers. The third metal redistribution layer is a via. In some implementations, the first, second, and third metal redistribution layers are configured to operate as a toroid inductor in the integrated device. In some implementations, the first, second, and third redistribution layers form a set of windings for the toroid inductor.

主权项

1. An integrated device comprising:
a substrate; a plurality of metal layers coupled to the substrate; a plurality of dielectric layers coupled to the substrate; and a redistribution portion coupled to one of the metal layers, the redistribution portion comprising:
a first metal redistribution layer; anda second metal redistribution layer coupled to the first metal redistribution layer, wherein the first and second metal redistribution layers are configured to operate as a toroid inductor in the integrated device.