发明名称 SEMICONDUCTOR DEVICE MODELS INCLUDING RE-USABLE SUB-STRUCTURES
摘要 Methods and tools for generating measurement models of complex device structures based on re-useable, parametric models are presented. Metrology systems employing these models are configured to measure structural and material characteristics associated with different semiconductor fabrication processes. The re-useable, parametric sub-structure model is fully defined by a set of independent parameters entered by a user of the model building tool. All other variables associated with the model shape and internal constraints among constituent geometric elements are pre-defined within the model. In some embodiments, one or more re-useable, parametric models are integrated into a measurement model of a complex semiconductor device. In another aspect, a model building tool generates a re-useable, parametric sub-structure model based on input from a user. The resulting models can be exported to a file that can be used by others and may include security features to control the sharing of sensitive intellectual property with particular users.
申请公布号 WO2015109035(A1) 申请公布日期 2015.07.23
申请号 WO2015US11487 申请日期 2015.01.14
申请人 KLA-TENCOR CORPORATION 发明人 ILORETA, JONATHAN;LAFFIN, MATTHEW A.;POSLAVSKY, LEONID;KAACK, TORSTEN;ZHAO, QIANG;LEE, LIE-QUAN
分类号 H01L21/66 主分类号 H01L21/66
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