| 摘要 |
PROBLEM TO BE SOLVED: To provide a device, system and method for inspecting a defect in a blind hole of a circuit board, capable of effectively visually inspecting the conductive contact of a blind hole bottom.SOLUTION: A method for inspecting a defect in a blind hole of a circuit board comprises the steps of: irradiating a circuit board to be measured with irradiating light having a non-visible light wavelength band (S101); capturing image data of the circuit board to be measured (S103); discriminating the outline of the blind hole bottom on the basis of the image data (S105); determining whether a defect is in the area of the blind hole bottom on the basis of the outline (S107); and outputting the determined result (S109). |
