COMPACT POWER DETECTION CIRCUIT UTILIZING GROUND VIA COUPLING

摘要

An RF electronics module includes a grounding plate, a non-conductive substrate, a number of conductive vias, RF PA circuitry, and RF power detection circuitry. The non-conductive substrate is over the grounding plate. The conductive vias extend parallel to one another from a surface of the non-conductive substrate opposite the grounding plate through the non-conductive substrate to the grounding plate. The RF PA circuitry is coupled to the grounding plate through a first one of the conductive vias. The RF power detection circuitry is coupled to a second one of the conductive vias and configured to measure a signal induced in the second one of the conductive vias due to electromagnetic coupling with the first one of conductive vias. The first one of the conductive vias is adjacent to the second one of the conductive vias.

主权项

1. A radio frequency (RF) electronics module comprising:
a grounding plate; a non-conductive substrate over the grounding plate; a plurality of conductive vias extending parallel to one another from a surface of the non-conductive substrate opposite the grounding plate through the non-conductive substrate to the grounding plate; RF power amplifier (PA) circuitry coupled to the grounding plate through a first one of the plurality of conductive vias; and RF power detection circuitry coupled to a second one of the plurality of conductive vias and configured to measure a signal induced in the second one of the plurality of conductive vias due to electromagnetic coupling with the first one of the plurality of conductive vias, wherein the first one of the plurality of conductive vias is adjacent to the second one of the plurality of conductive vias.