| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a suspension, in which a seed layer present below a wiring layer is prevented from excessive etching.SOLUTION: The substrate for a suspension includes a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer; and the substrate includes a diffusion part between the insulating layer and the wiring layer, formed by mutual diffusion of metal components in a first metal part formed on the insulating layer and a second metal part formed on the first metal part. The second metal part includes a metal component different from the first metal part and is a part of the wiring layer. A terminal part for connecting an element mounted on the suspension substrate or an external circuit board is provided with a terminal plating. |
