| 摘要 |
When manufacturing three-dimensional electronic device 11 by layering multiple layer cross sections 12 sliced at a predetermined thickness of three-dimensional electronic device 11 which is the target for forming, first, each layer cross section 12 using multiple types of materials is formed by being layered on top of the layer cross section 12 underneath, and each time a layer cross section 12 is formed, the cross section 12 is cured or sintered by being exposed to ultraviolet light, a laser beam, visible light, and so on. The forming method for each cross section 12 may be forming cross section 12 by discharging a binder via a droplet discharge method such as inkjet printing or dispensing, or by spreading a layer of powdered material and bonding the powdered material by discharging a binder or sintering it by exposing it to a laser beam. |
