发明名称 透光性硬質基板積層体の製造方法及び透光性硬質基板貼り合わせ装置
摘要 <p>Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, the entire fixing agent interposed and spreading between both translucent rigid substrates is cured everytime the translucent rigid substrates are bonded.</p>
申请公布号 JP5753099(B2) 申请公布日期 2015.07.22
申请号 JP20110550885 申请日期 2011.01.13
申请人 電気化学工業株式会社 发明人 栗村 啓之;宮崎 隼人;中島 剛介
分类号 C03B33/07;C03B33/023;C03C19/00;C03C27/10;C09J5/04 主分类号 C03B33/07
代理机构 代理人
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