<p>A fluid ejection device includes a thin film heater resistor portion having a heater resistor, and a two-layer structure disposed over the heater resistor. The two-layer structure includes a top layer and a bottom layer, with the top layer having a hardness that is at least 1.5 times greater than the hardness of the bottom layer.</p>
申请公布号
EP2563596(B1)
申请公布日期
2015.07.22
申请号
EP20100850862
申请日期
2010.04.29
申请人
HEWLETT PACKARD DEVELOPMENT COMPANY, L.P.
发明人
ABBOTT, JAMES, E., JR.;AJAYI, SAMUEL;BENGALI, SADIQ;HORVATH, STEPHEN;LONG, GREG, S.;PRAKASH, SATYA;PAN, ALFRED I-TSUNG;SHAARAWI, MOHAMMED, S.;PUGLIESE, ROBERTO, A.
