发明名称 半導体装置及び半導体装置の製造方法
摘要 <p>A semiconductor device includes a buffer layer that is disposed over a substrate, a high-resistance layer that is disposed over the buffer layer, the high-resistance layer being doped with a transition metal for achieving high resistance, a low-resistance region that is disposed in a portion of the high-resistance layer or over the high-resistance layer, the low-resistance region being doped with an impurity element for achieving low resistance, an electron travel layer that is disposed over the high-resistance layer including the low-resistance region, an electron supply layer that is disposed over the electron travel layer, a gate electrode that is disposed over the electron supply layer, and a source electrode and a drain electrode that are disposed over the electron supply layer.</p>
申请公布号 JP5751074(B2) 申请公布日期 2015.07.22
申请号 JP20110168781 申请日期 2011.08.01
申请人 发明人
分类号 H01L21/338;H01L21/205;H01L29/778;H01L29/812 主分类号 H01L21/338
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