Thermally reversible thermal interface materials with improved moisture resistance

摘要

The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a hydrolytically-stable, thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×1011 ohm-cm or more.;The thermally reversible adhesive comprises a functionalized aminopropyl methylsiloxane-dimethylsiloxane copolymer containing a plurality of dienophile functional groups bonded through an imide linkage, preferably maleimide groups, and a crosslinking agent containing a plurality of diene functional group, preferably furan groups. The reactive groups undergo a Diels Alder crosslinking reaction.

主权项

1. A thermal interface material comprising:
a thermally-reversible adhesive, wherein the thermally-reversible adhesive comprises: a functionalized aminopropylmethylsiloxane-dimethylsiloxane copolymer containing a plurality of a dienophile functional group covalently bonded to the copolymer through an imide linkage; and a cross-linking agent containing a plurality of a diene functional group; and a thermally conductive and electrically non-conductive filler,wherein the thermal interface material having an amount of the filler effective to provide a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×1011 ohm-cm or more.