发明名称 HEAT DISSIPATION UNIT
摘要 <p>The invention provides a core and clad. Core provides surface for screw holes, channel(s) for conductors and/or air. Core shall provide additional channel(s) for conductors where extra depth is required between clad for attachments, conductors, and air. Clad is snug to core to meet thermal dissipation requirements. Clad may be used to shade surface mount diode. Clad shall provide additional channel(s) for conductors where extra depth is required between core for attachments, conductors, and air.</p>
申请公布号 CA2839902(A1) 申请公布日期 2015.07.21
申请号 CA20142839902 申请日期 2014.01.21
申请人 TINKER, JAMES 发明人 TINKER, JAMES
分类号 H05K7/20;H02G3/04;H05K1/16 主分类号 H05K7/20
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