| 主权项 |
1. A method comprising:
providing a first die having (i) a first surface, (ii) a second surface that is opposite to the first surface, (iii) a third surface that is perpendicular to the first surface, and (iii) a fourth surface that is perpendicular to the first surface, wherein the second surface of the first die comprises a first bond pad, wherein the first bond pad of the first die is configured to route electrical signals of the first die; attaching the first surface of the first die to a layer of a substrate; attaching the second surface of the first die to a first surface of an interposer, wherein the interposer comprises a first via, and wherein the interposer has (i) the first surface, and (ii) a second surface that is opposite to the first surface, (iii) a third surface that is perpendicular to the first surface, and (iii) a fourth surface that is perpendicular to the first surface; forming one or more additional layers of the substrate to embed the first die and the interposer in the substrate such that the one or more additional layers of the substrate is attached to (i) the third surface and the fourth surface of the first die and (ii) the third surface and the fourth surface of the interposer; and coupling a second die to the one or more additional layers of the substrate, wherein the second die has a surface comprising a second bond pad, and wherein the second bond pad of the second die is configured to route electrical signals of the second die, wherein the second die is coupled to the one or more additional layers of the substrate such that electrical signals are routed between the first die and the second die via (i) the first bond pad of the first die, (ii) the first via of the interposer, (iii) a routing structure that is in part disposed within the one or more additional layers of the substrate, and (iv) the second bond pad of the second die. |
