| 摘要 |
The present invention relates to a method for manufacturing a wiring substrate, comprising: a step of forming a groove part (4) by removing a support metal foil (1), which is located on the outer circumference of a metal foil (2) which is a metal foil (11) maintained through a peeling layer on the support metal foil (1) and to which the support metal foil is attached, as a frame form; a step of stacking the metal foil (2), to which the support metal foil is attached, to face a main surface (3a) of a support substrate (3P) and a metal foil lower surface (11a) exposed from the groove part (4) on the main surface (3a) of the support substrate (3P) containing an uncured thermosetting resin, and heat curing the support substrate (3P) by pressing and heating the same to adhere the metal foil lower surface (11a) to the main surface (3a); a step of forming a laminate (10) for a wiring substrate on a metal foil upper surface (11b) located in the inner area (B) of the groove part (4); a step of cutting the support substrate (3) and the laminate (10) located in the inner area (B); and a step of separating the laminate (10) from the support metal foil (1). |
