| 摘要 |
PROBLEM TO BE SOLVED: To provide an interposer for electronic circuit chip package.SOLUTION: An interposer for electronic circuit chip package may include a substrate, a recess, a first conductive via, and a second conductive via. The substrate may have a first surface, a second surface substantially parallel with the first surface and on the opposite side thereof, a third surface substantially parallel with the first surface and second surface, and an orthogonal surface substantially perpendicular to the first surface and third surface and intersecting them. The recess is formed in the substrate, and may be defined by the third surface and orthogonal surface. The first conductive via may pass from the second surface to the first surface. The second conductive via may pass from the second surface to the third surface. |
