WAFER LEVEL PACKAGE WITH REDISTRIBUTION LAYER FORMED WITH METALLIC POWDER

摘要

A semiconductor device is assembled where a signal redistribution layer is formed over a partially encapsulated semiconductor die. The distribution layer is formed by selectively coating a first electrical insulating layer over an active surface of the die and a surrounding portion of the encapsulation material, where die bonding pads on the active surface of the die are exposed through access apertures in the first electrical insulating layer. A layer of metallic powder is deposited onto the first insulating layer and then electrically conductive runners are formed from the layer of metallic powder. The runners are coated with a further electrical insulating layer. A mounting area of each runner is exposed through an external connection aperture. Solder balls may be attached to the mounting areas.

主权项

1. A method of assembling a semiconductor device, the method comprising:
providing a partially formed package including a semiconductor die and an encapsulating region, wherein a support surface of the partially formed package includes an active surface of the die and an adjacent surface of the encapsulating region; selectively coating the support surface with a first electrical insulating layer so that bonding pads on the active surface of the die are exposed through access apertures in the first electrical insulating layer; depositing a layer of metallic powder onto the first electrical insulating layer, wherein the powder fills the access apertures; forming electrically conductive runners from the layer of metallic powder, the runners being selectively connected to the die bonding pads through the access apertures; removing regions of the layer of metallic powder that do not form the runners; and selectively coating the runners with a further electrical insulating layer so that a mounting area of each runner is exposed through an external connection aperture in the further electrical insulating layer, thereby forming the semiconductor device.