发明名称 ELECTROLYTIC TREATMENT METHOD AND DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To properly control a treatment state of an object to be treated during electrolytic treatment by using treatment ions in a treatment liquid.SOLUTION: A direct electrode 20 and a counter electrode 22 are respectively disposed so as to place a plating solution M therebetween, and an indirect electrode 21 is disposed which forms an electric field in the plating solution M. Copper ions in the plating solution M are moved to a counter electrode 22 side by continuously applying a direct-current voltage between the indirect electrode 21 and the counter electrode 22. The copper ions having been moved to the counter electrode 22 side are reduced by applying a pulse voltage between the direct electrode 20 and the counter electrode 22. When the copper ions are reduced, electric currents having different amounts of electric current per unit time are respectively supplied to counter electrodes 22a, 22b.</p>
申请公布号 JP2015129330(A) 申请公布日期 2015.07.16
申请号 JP20140001464 申请日期 2014.01.08
申请人 TOKYO ELECTRON LTD 发明人 IWAZU HARUO
分类号 C25D21/00;C25D5/18;C25D17/10;C25F7/00 主分类号 C25D21/00
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