发明名称 HEAT-FUSIBLE POLYIMIDE FILM, PRODUCTION METHOD OF HEAT-FUSIBLE POLYIMIDE FILM, AND POLYIMIDE METAL LAMINATE USING HEAT-FUSIBLE POLYIMIDE FILM
摘要 <p>PROBLEM TO BE SOLVED: To provide a heat-fusible polyimide film excellent in heat resistance and adhesiveness to metal, a production method of the heat-fusible polyimide film, and a polyimide metal laminate using the heat-fusible polyimide film.SOLUTION: A heat-fusible polyimide film is a multilayer film including a heat-fusible polyimide layer and a heat-resistant polyimide layer laminated in contact with the heat-fusible polyimide layer. The heat-fusible polyimide layer contains 50 mol% or more of 3,3',4,4'-biphenyl tetracarboxylic dianhydride in the entire tetracarboxylic acid dianhydride component, and contains over 50 mol% of 2,2-bis[4-(4-aminophenoxy)phenyl]propane in the entire diamine; and the heat-resistant polyimide layer contains 50 mol% or more of 3,3',4,4'-biphenyl tetracarboxylic dianhydride in the entire tetracarboxylic acid dianhydride component. The film shows a peel strength of 0.5 N/mm or more measured by the method of JIS C6471.</p>
申请公布号 JP2015128821(A) 申请公布日期 2015.07.16
申请号 JP20120282249 申请日期 2012.12.26
申请人 UBE IND LTD 发明人 IIIZUMI NOBORU;ARIHARA HIDEO;MASUI EIJI;YANAGIDA KEIICHI;KOCHIYAMA TAKURO
分类号 B32B15/088;B32B37/20;C08G73/10;H05K1/03 主分类号 B32B15/088
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