PRINTED CIRCUIT BOARD, CIRCUIT, AND METHOD FOR THE PRODUCTION OF A CIRCUIT

摘要

Disclosed is a circuit comprising a first printed circuit board (2a) and a second printed circuit board (2b). The first circuit board is provided with a metal supporting board (14) and an insulating layer (8) which electrically insulates the metal supporting board on a surface, the supporting board being without any insulating layer in at least one connection region (10a-10d). The supporting board is metal-coated (12) in the connection region, and a contact (30a) of a semiconductor (30) is electrically contacted on the metal coating of the connection region. The second circuit board is provided with a metal supporting board (2b), an insulator (16) that electrically insulates the metal supporting board (24) on a surface, and a conducting layer (18) that is applied to the insulator. The insulator and the conducting layer have a breakdown region (21) in at least one contact zone, and at least one metal contact pad (20) is arranged in the contact zone in such a way that the contact pad is peripherally disposed at a distance from the insulator and from the conducting layer. The circuit boards in the circuit are separated from one another by an air gap (28) and are mechanically interconnected by at least one power semiconductor device (30).