发明名称 熱硬化性樹脂組成物タブレットおよびそれを用いた半導体のパッケージ
摘要 <P>PROBLEM TO BE SOLVED: To provide a curable resin composition tablet which provides a cured product striking a balance between handling ability at normal temperature and fusibility at high temperature and which has high light ray reflectance and good resistance against heat and light. <P>SOLUTION: The curable resin composition contains, as essential ingredients, (A) a compound that contains at least two carbon-carbon double bonds, which are reactive with an SiH group, in each molecule, (B) a compound that contains at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a white pigment, and (E) an inorganic filler. At least one of the components (A) and (B) is liquid having viscosity of &le;50 Pa per second at 23&deg;C. The total content of the components (D) and (E) is 70-95 wt.%. Particles of &le;12 microns accounts for &ge;40 vol.% of the total of the components (D) and (E). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5749543(B2) 申请公布日期 2015.07.15
申请号 JP20110081753 申请日期 2011.04.01
申请人 发明人
分类号 C08J3/12;C08G77/54;C08K3/22;C08K3/36;C08L83/05;C08L83/07;H01L23/29;H01L23/31;H01L33/48 主分类号 C08J3/12
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