| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a processing method of an optical device wafer and a laser processing device capable of cutting an optical device wafer in which an optical device layer is mounted on a surface of a metal substrate along a street even if a number of times for laser beam irradiation is small. <P>SOLUTION: A processing method of an optical device wafer divides an optical device wafer having an optical device layer mounted thereon along a plurality of streets, the optical device layer having an optical device formed on a plurality of regions partitioned by the streets formed in a lattice shape on a surface of a metal substrate. This processing method includes an optical device wafer supporting step of sticking the optical device wafer to a surface of an adhesive tape mounted on an annular frame and a laser beam irradiation step of irradiating the adhesive tape to which the optical device wafer is stuck with a laser beam along the streets, the adhesive tape expanded. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
