LEAD-FREE SOLDER ALLOY FOR VEHICLE GLASS

摘要

A lead-free solder alloy for a vehicle glass according to the present invention contains 26.0 to 56.0 mass% of In, 0.1 to 5.0 mass% of Ag, 0.002 to 0.05 mass% of Ti, 0.001 to 0.01 mass% of Si and the balance being Sn. The lead-free solder alloy may optionally contain 0.005 to 0.1 mass% of Cu and 0.001 to 0.01 mass% of B. This solder alloy can suitably be applied vehicle glasses and show good joint strength to glass materials and high acid resistance, salt water resistance and temperature cycle resistance.