| 摘要 |
<p>The present invention relates to an apparatus and a method for manufacturing a semiconductor device. According to an embodiment of the present invention, the apparatus for manufacturing a semiconductor device comprises: a comb mounting unit having a wafer mountable shape, which includes at least one mounting groove arranged as a comb type; and a foreign substance removing unit to spray air to the mounting groove by approaching to the comb mounting unit.</p> |
