| 摘要 |
<p>Disclosed are a flexible printed circuit board with high corrosion resistance and high heat radiation and a manufacturing method thereof. The flexible printed circuit board with high corrosion resistance and high heat radiation according to the present invention includes a base film, a circuit pattern which is bonded on the upper side of the base film and includes a signal pattern and a ground pattern, a top coverlay which is bonded on the circuit pattern and includes an opening part to expose a part of the signal pattern, a plating layer which is successively stacked on the signal pattern exposed by the opening part, a connection terminal which includes a corrosion prevention layer and a surface layer, a ground layer which is attached on the lower side of the base film, a bottom coverlay which is bonded on the lower side of the ground layer, and a ground via which is inserted into the inner side of the base film and is connected to the lower side of the ground pattern and the upper side of the ground layer.</p> |
