发明名称 LED CHIP-ON-BOARD COMPONENT AND LIGHTING MODULE
摘要 <p>An object of the present invention is to provide a Light Emitting Diode (LED) lamp construction comprising at least one light emitter component, a primary heat sink, and a secondary heat sink. The primary heat sink is in direct contact with the light emitter component and the primary heat sink is electrically insulated from the environment. Significant advantage is obtained by having a primary heat sink in direct contact with a light emitter component, such as a light emitting diode, and simultaneously electrically insulated from the environment. Direct contact between the die or diode and the primary heat sink allows for the most efficient heat transfer, thus more effectively cooling the element. This effect is particularly effective when the primary heat sink is a good thermal and even good electrical conductor. This direct contact between an electrical component such as the light emitting element and a good thermal and electrical conductor such as the primary heat sink is made possible by the electrically insulated nature of the primary heat sink. Thus, shorts are able to be eliminated and an effective heat dissipating construction is made possible. Numerous advantages are further realized by an LED construction having superior thermal dissipation properties from the light emitting element.</p>
申请公布号 EP2893573(A1) 申请公布日期 2015.07.15
申请号 EP20130777300 申请日期 2013.09.09
申请人 LUMICHIP LIMITED 发明人 RANTALA, JUHA
分类号 H01L33/64 主分类号 H01L33/64
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