发明名称 Intermetallic nanoparticles
摘要 A process for preparing intermetallic nanoparticles of two or more metals is provided. In particular, the process includes the steps: a) dispersing nanoparticles of a first metal in a solvent to prepare a first metal solution, b) forming a reaction mixture with the first metal solution and a reducing agent, c) heating the reaction mixture to a reaction temperature; and d) adding a second metal solution containing a salt of a second metal to the reaction mixture. During this process, intermetallic nanoparticles, which contain a compound with the first and second metals are formed. The intermetallic nanoparticles with uniform size and a narrow size distribution is also provided. An electrochemical device such as a battery with the intermetallic nanoparticles is also provided.
申请公布号 US9079249(B2) 申请公布日期 2015.07.14
申请号 US201113250442 申请日期 2011.09.30
申请人 UChicago Argonne, LLC 发明人 Singh Dileep;Yusufoglu Yusuf;Timofeeva Elena;Routbort Jules
分类号 B22F9/18;B22F9/20;B22F9/24;C09K5/10;H01M4/38;B22F1/00;C22C1/04;F28F23/00;H01M10/0525 主分类号 B22F9/18
代理机构 Foley & Lardner LLP 代理人 Foley & Lardner LLP
主权项 1. A process comprising: dispersing Sn nanoparticles in a solvent to prepare a first metal suspension; forming a reaction mixture comprising the first metal solution and a reducing agent selected from the group consisting of phosphinates and hydrides; adjusting the reaction mixture to a reaction temperature between about 50° C. and 200° C.; and adding a second metal solution comprising a salt of Cu to the reaction mixture; forming intermetallic nanoparticles are formed by reaction, the intermetallic nanoparticles comprising Sn and Cu.
地址 Chicago IL US