发明名称 |
Intermetallic nanoparticles |
摘要 |
A process for preparing intermetallic nanoparticles of two or more metals is provided. In particular, the process includes the steps: a) dispersing nanoparticles of a first metal in a solvent to prepare a first metal solution, b) forming a reaction mixture with the first metal solution and a reducing agent, c) heating the reaction mixture to a reaction temperature; and d) adding a second metal solution containing a salt of a second metal to the reaction mixture. During this process, intermetallic nanoparticles, which contain a compound with the first and second metals are formed. The intermetallic nanoparticles with uniform size and a narrow size distribution is also provided. An electrochemical device such as a battery with the intermetallic nanoparticles is also provided. |
申请公布号 |
US9079249(B2) |
申请公布日期 |
2015.07.14 |
申请号 |
US201113250442 |
申请日期 |
2011.09.30 |
申请人 |
UChicago Argonne, LLC |
发明人 |
Singh Dileep;Yusufoglu Yusuf;Timofeeva Elena;Routbort Jules |
分类号 |
B22F9/18;B22F9/20;B22F9/24;C09K5/10;H01M4/38;B22F1/00;C22C1/04;F28F23/00;H01M10/0525 |
主分类号 |
B22F9/18 |
代理机构 |
Foley & Lardner LLP |
代理人 |
Foley & Lardner LLP |
主权项 |
1. A process comprising:
dispersing Sn nanoparticles in a solvent to prepare a first metal suspension; forming a reaction mixture comprising the first metal solution and a reducing agent selected from the group consisting of phosphinates and hydrides; adjusting the reaction mixture to a reaction temperature between about 50° C. and 200° C.; and adding a second metal solution comprising a salt of Cu to the reaction mixture; forming intermetallic nanoparticles are formed by reaction, the intermetallic nanoparticles comprising Sn and Cu. |
地址 |
Chicago IL US |