Conductive pads and methods of formation thereof

摘要

In one embodiment, a device includes a first conductive pad disposed over a substrate, and a etch stop layer disposed over a top surface of the first conductive pad. The device further includes a solder barrier disposed over the etch stop layer.

主权项

1. A method of forming a device, the method comprising:
forming a first conductive pad and a second conductive pad over a substrate; forming a etch stop layer over the first conductive pad and the second conductive pad; forming a solder layer over the etch stop layer, wherein the solder layer is configured to form a solder with another material; removing the solder layer from over the first conductive pad using a first etch process; and removing the etch stop layer from over the first conductive pad using a second etch process, wherein the second etch process selectively removes the etch stop layer relative to the underlying first conductive pad.