发明名称 Camera module
摘要 An exemplary embodiment of the present disclosure includes a first PCB Printed Circuit Board mounted with an image sensor, a housing unit arranged on an upper portion of the first PCB, a holder module spaced apart from an inner bottom surface of the housing unit at a predetermined distance, wound on a periphery with a first coil and having at least one lens thereinside, a second PCB mounted on an upper portion of the holder module, a plate member coupled to a bottom surface of the holder module, a plurality of wire springs connected at one end to the second PCB and connected at the other end to the plate member, and a coil fixing unit configured to fixedly position the first coil to a periphery of the holder module.
申请公布号 US9083874(B2) 申请公布日期 2015.07.14
申请号 US201314099297 申请日期 2013.12.06
申请人 LG INNOTEK CO., LTD. 发明人 Lee SungGuk;Jung Taejin
分类号 H04N5/228;H04N5/225;H04N5/232 主分类号 H04N5/228
代理机构 代理人
主权项 1. A camera module, the camera module comprising: a first PCB (Printed Circuit Board) mounted with an image sensor; a housing unit arranged on an upper portion of the first PCB; a holder module spaced apart from an inner bottom surface of the housing unit at a predetermined distance, wound on a periphery with a first coil and having at least one lens thereinside; a second PCB mounted on an upper portion of the holder module; a plate member coupled to a bottom surface of the holder module; a plurality of wire springs connected at one end to the second PCB and connected at the other end to the plate member; and a coil fixing unit configured to fixedly position the first coil to a periphery of the holder module, wherein the coil fixing unit comprises a plurality of fixing protrusions each formed at a periphery of the holder module, a coil reception groove formed at the periphery of the holder module to have a first depth, and an adhesive input groove formed between the fixing protrusions to have a second depth.
地址 Seoul KR