Semiconductor package with improved thermal properties

摘要

A semiconductor package, comprises an encapsulant which contains a semiconductor substrate, the package lower side being mountable on a surface. The semiconductor substrate backside is in close proximity of the semiconductor package lower side for improved thermal conductivity to the surface. The active side of the semiconductor substrate, facing the upper side of the semiconductor package, has a plurality of die contacts. A plurality of electrically conductive interconnects are connected to the die contacts and extend to the lower side of the semiconductor package for connecting the die contacts to the surface.

主权项

1. A semiconductor package comprising:
an encapsulant comprising:
an upper side; anda lower side mountable on a surface; a semiconductor substrate in the encapsulant, the substrate comprising:
a backside proximal the lower side of the encapsulant for thermal connection to the surface; andan active side distal the lower side of the encapsulant, the active side of the substrate including a plurality of die contacts; a plurality of electrically conductive interconnects extending to the lower side of the encapsulant for electrically connecting the die contacts of the substrate to the surface; and a heat spreader in thermal contact with the backside of the semiconductor substrate for aiding thermal connection to the surface.