发明名称 Spalling with laser-defined spall edge regions
摘要 Laser ablation can be used to form a trench within at least a blanket layer of a stressor layer that is atop a base substrate. A non-ablated portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can also be used to form a trench within a blanket material stack including at least a plating seed layer. A stressor layer is formed on the non-ablated portions of the material stack and one portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can be further used to form a trench that extends through a blanket stressor layer and into the base substrate itself. The trench has an edge that defines the edge of the material layer region to be spalled.
申请公布号 US9079269(B2) 申请公布日期 2015.07.14
申请号 US201113302427 申请日期 2011.11.22
申请人 International Business Machines Corporation 发明人 Bedell Stephen W.;Cheng Cheng-Wei;Fogel Keith E.;Sadana Devendra K.;Saenger Katherine L.;Sosa Cortes Norma E.;Li Ning;Alhomoudi Ibrahim
分类号 B23K26/00;H01L21/304;B23K26/06;B23K26/36;B23K26/40 主分类号 B23K26/00
代理机构 Scully, Scott, Murphy & Presser, P.C. 代理人 Scully, Scott, Murphy & Presser, P.C. ;Percello, Esq. Louis J.
主权项 1. A method of removing a material layer region of a base substrate, said method comprising: forming at least a stressor layer atop an uppermost surface of a base substrate; forming a trench by laser ablation at least within the stressor layer to define an edge of a material layer region to be spalled; and spalling the material layer region of the base substrate.
地址 Armonk NY US
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