| 摘要 |
<p>The present invention relates to a printed circuit board. According to the present invention, unlike the conventional art, the printed circuit board is capable of reducing stress, caused by contact between a drill bit and prepreg, by performing a drill process for processing a sound hole after a plug process after primary Cu plating. Therefore, a prepreg edge phenomenon and a solder resist surface damage, which are shown when the sound is being processed, are reduced, and therefore, the quality of sound delivery is improved. A manufacture method for the printed circuit board includes a step of preparing a copper foil laminated plate; and a step of processing a via hole on the copper foil laminated plate.</p> |
