CUTTING LIQUID COMPOSITION FOR FIXED ABRASIVE GRAIN WIRE SAW

摘要

PROBLEM TO BE SOLVED: To provide a cutting fluid composition for a fixed abrasive grain wire saw, which exhibits, when cutting a silicon ingot, good dispersibility of cutting powder and permeability into a cut part.SOLUTION: Provided is a cutting fluid composition for a fixed abrasive grain wire saw, comprising a cutting fluid base (component A), at least one surfactant (component B) selected from anionic surfactants, cationic surfactants, and nonionic surfactants having a cloud point of 65°C or more, and water (component C), where viscosity of the composition at 25°C is 1 mPa s or more and 25 mPa s or less, and a total content of the component A is 50 mass% or more and 85 mass% or less. The component A contains both of R-O-(CH-CH-O)-H and R-O-(CH-CH(CH)-O)-H, and the cloud point of the component A is a value in a range of 30°C or more and less than 65°C. Here, the Rand Reach represent an alkyl group having 3 to 8 carbon atoms; p and q represent an average number of moles of addition; and p is an integer between 3 and 6, and q is an integer between 1 and 6.