ETCHING LIQUID, ETCHING METHOD, AND METHOD OF MANUFACTURING SOLDER BUMP

摘要

An etching Liquid which can selectively remove only a copper layer in an etching process of a multilayer structure including a cobalt layer and the copper layer is disclosed. The etching liquid is an etching liquid for etching the copper layer in the multilayer structure including the copper layer and the cobalt layer. This etching liquid includes at least one acid selected from a group consisting of citric acid, oxalic acid, malic acid, and malonic acid, and hydrogen peroxide, the etching liquid having pH in a range of 4.3 to 5.5.

主权项

1. An etching liquid for etching a copper layer in a multilayer structure including the copper layer and a cobalt layer, comprising:
at least one acid selected from a group consisting of citric acid, oxalic acid, malic acid, and malonic acid; and hydrogen peroxide, the etching liquid having pH in a range of 4.3 to 5.5.