发明名称 |
POLYAMIDEIMIDE RESIN, INSULATING COATING MATERIAL, INSULATING COATING AND INSULATING WIRE USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide primarily a polyamideimide resin excellent in heat resistance and further improved in breakdown voltage so as to contribute to high-voltage driving; and to provide secondly a polyamideimide resin contributing further to downsizing, weight saving and the like.SOLUTION: This polyamideimide resin is obtained by reacting: a polycarboxylic acid compound essentially including trivalent or higher polycarboxylic acid anhydride having an acid anhydride and a carboxyl group; 2,2-bis(4-(4-aminophenoxy)phenyl)hexafluoropropane represented by the general formula (1); and another aromatic polyamino compound or an aromatic polyisocyanate compound in a basic polar solvent. |
申请公布号 |
JP2015127424(A) |
申请公布日期 |
2015.07.09 |
申请号 |
JP20150064531 |
申请日期 |
2015.03.26 |
申请人 |
HITACHI CHEMICAL CO LTD |
发明人 |
OKAWARA TOSHIICHI;ZHONG HUIFENG |
分类号 |
C08G73/14;C08G18/38;H01B3/30;H01B7/02 |
主分类号 |
C08G73/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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