发明名称 POLYAMIDEIMIDE RESIN, INSULATING COATING MATERIAL, INSULATING COATING AND INSULATING WIRE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide primarily a polyamideimide resin excellent in heat resistance and further improved in breakdown voltage so as to contribute to high-voltage driving; and to provide secondly a polyamideimide resin contributing further to downsizing, weight saving and the like.SOLUTION: This polyamideimide resin is obtained by reacting: a polycarboxylic acid compound essentially including trivalent or higher polycarboxylic acid anhydride having an acid anhydride and a carboxyl group; 2,2-bis(4-(4-aminophenoxy)phenyl)hexafluoropropane represented by the general formula (1); and another aromatic polyamino compound or an aromatic polyisocyanate compound in a basic polar solvent.
申请公布号 JP2015127424(A) 申请公布日期 2015.07.09
申请号 JP20150064531 申请日期 2015.03.26
申请人 HITACHI CHEMICAL CO LTD 发明人 OKAWARA TOSHIICHI;ZHONG HUIFENG
分类号 C08G73/14;C08G18/38;H01B3/30;H01B7/02 主分类号 C08G73/14
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