METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE SUBSTRATE MANUFACTURED USING THE SAME

摘要

A method of manufacturing a semiconductor package substrate has a simplified process and an upper and lower pattern alignment problem is solved. A semiconductor package substrate is manufactured by the method. The method of manufacturing a semiconductor package substrate includes forming a first groove in one surface of a base substrate of a conductive material, filling the first groove with resin, and etching another surface of the base substrate to expose the resin filling the first groove.

主权项

1. A method of manufacturing a semiconductor package substrate, the method comprising:
forming a first groove in one surface of a base substrate of a conductive material; filling the first groove with resin; and etching another surface of the base substrate to expose the resin filling the first groove.