| 摘要 |
<p>The purpose of the present invention is to provide a vapor-deposition device and method whereby, although substrates are increasing in size, a correspondingly larger vapor-deposition mask is not used; that is, relative movement between the substrate and mask at a separation from each other makes it possible to use a vapor-deposition mask smaller than the substrate to deposit a film, in a pattern produced by said mask, over a wide area. Said vapor-deposition device and method also prevent film-pattern overlap, minimize incident radiant heat from an evaporation source, and allow fast, precise vapor deposition. A mask holder (6) that has scatter-control parts provided with control openings (5) is provided between the evaporation source (1) and the substrate (4). The abovementioned vapor-deposition mask (2) is attached to said mask holder (6). While being kept at a distance from said vapor-deposition mask (2), the substrate (4) is made able to move freely relative to the evaporation source (1) and the mask holder (6) with the vapor-deposition mask (2) attached thereto. The evaporation source (1) is formed from a material that has a lower linear expansion coefficient than stainless steel.</p> |
