| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a carrier-fitted copper foil having satisfactory etching properties.SOLUTION: Provided is a carrier-fitted copper foil including: a carrier; an intermediate layer; and an extra-thin copper layer in this order. The intermediate layer includes Ni, and when the carrier-fitted copper foil is heated at 220°C for 2 hr, and thereafter, in accordance with JIS C 6471, the extra-thin copper layer is peeled, the coating weight of Ni in the surface on the intermediate layer side is 400μg/dmor lower, the surface roughness Rz of the extra-thin copper layer measured using a touch needle type roughness gage in accordance with JIS B 0601-1982 being 0.2 to 1.5μm, and the standard deviation of the surface roughness Rz is 0.6μm or lower.</p> |
