| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which has a high throughput. <P>SOLUTION: The substrate processing apparatus includes a polishing section 3 configured to polish a substrate W, transfer mechanisms 5 and 6 configured to transfer the substrate W, and a cleaning section 4 configured to clean and dry the polished substrate W. The cleaning section 4 has plural cleaning lines for cleaning plural substrates. The plurality of cleaning lines have plural cleaning modules 201A, 201B, 202A, 202B, and the plurality of plural transfer robots 209 and 210 transfer the substrates. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
