| 摘要 |
<p>Provided is an apparatus and a method for drying and treating a substrate. The apparatus for treating the substrate comprises: a spin head supporting and rotating the substrate; a liquid supply unit having a nozzle which supplies a liquid on the substrate supported on the spin head; a heating unit heating some areas of the substrate supported on the spin head; and a controller controlling the liquid supply unit and the heating unit. The heating unit comprises: an arm; a heater combined on the arm; and an arm transfer member transferring the arm. The controller controls the arm transfer member so that a teacher heats a boundary surface when the boundary surface of a liquid film and an area in which the liquid film is removed is transferred from a center area of the substrate to an edge area by rotation of the substrate. Accordingly, the present invention can prevent decrease of the temperature of the substrate when the liquid is evaporated by heating the substrate.</p> |
